Characterization of heated atomic force microscope cantilevers in air and vacuum

Jungchul Lee, Mark Abel, Tanya L. Wright, Erik Sunden, Alexei Marchenkov, Samuel Graham, William P. King

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents characterization of heated atomic force microscope (AFM) cantilevers in air and helium, both at atmospheric pressure and in a partially evacuated environment. The cantilevers are made of doped single-crystal silicon using a standard silicon-on-insulator cantilever fabrication process. The electrical measurements show the link between the cantilever temperature-dependant electrical characteristics, electrical resistive heating, and thermal properties of the heated AFM cantilever and its surroundings. Laser Raman thermometry measures temperature along the cantilever with resolution near 1 μm and 4°C. By modulating the gaseous environment surrounding the cantilever, it is possible to estimate the microscale thermal coupling between the cantilever and its environment. This work seeks to improve the calibration and design of heated AFM cantilevers.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1767-1772
Number of pages6
StatePublished - 2006
Externally publishedYes
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Keywords

  • Atomic force microscopy (AFM)
  • Knudsen flow
  • Microelectromechanical systems (MEMS)
  • Thermometry
  • Vacuum measurement

ASJC Scopus subject areas

  • General Engineering

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