Cell-based OPC with standard-cell fill insertion

Liang Deng, Kai Yuan Chao, Hua Xiang, Martin D.F. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Litho-aware design methodology is the key to enable the aggressive scaling down to the future technology node. Boundary based methodology for cellwise OPC has been proposed to account for influence from fezatures of neighboring cells [1]. As technology advances toward 32 and 22 nm, more columns of features are needed as representative environments for the boundary-based cellwise OPC. In this paper, we propose a new method that combines the fill insertion and boundary-based cellwise OPC to reduce the mask data size as well as the prohibitive runtime of full-chip OPC, making cell characterization more predictable. To make the number of cell OPC solutions easy to handle, we present a new methodology which uses dummy fill insertion both inside and outside cells to solve the issue for technologies beyond 45 nm. Experimental results show a solid 30% improvement on average and maximum edge placement errors (EPE) over the previous work [1].

Original languageEnglish (US)
Title of host publicationDesign for Manufacturability through Design-Process Integration II
DOIs
StatePublished - 2008
EventDesign for Manufacturability through Design-Process Integration II - San Jose, CA, United States
Duration: Feb 28 2008Feb 29 2008

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6925
ISSN (Print)0277-786X

Other

OtherDesign for Manufacturability through Design-Process Integration II
Country/TerritoryUnited States
CitySan Jose, CA
Period2/28/082/29/08

Keywords

  • Cellwise OPC
  • Design for manufacturing
  • Fill insertion
  • Lithography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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