@inproceedings{d1a5cb8c5d7a4a2cb2d16ce1c73f5ee0,
title = "CDM simulation study of a system-in-package",
abstract = "This work presents a CDM circuit-level model for stacked die in a BGA package. Circuit simulation is used to investigate the voltage stress on the die-to-die interface circuits. The power net connections are found to impact the CDM reliability. An ESD protection scheme for the die-to-die interface circuits is proposed.",
author = "Vrashank Shukla and Elyse Rosenbaum",
year = "2010",
language = "English (US)",
isbn = "1585371823",
series = "Electrical Overstress/Electrostatic Discharge Symposium Proceedings",
booktitle = "Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010, EOS/ESD 2010",
note = "32nd Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2010 ; Conference date: 03-10-2010 Through 08-10-2010",
}