CDM-ESD induced damage in components using stacked-die packaging

Nicholas Olson; Nathan Jack; Vrashank Shukla; Elyse Rosenbaum

doi:10.1109/CICC.2011.6055359

CDM-ESD induced damage in components using stacked-die packaging

Nicholas Olson, Nathan Jack, Vrashank Shukla, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

CDM-ESD robustness of stacked-die packages is investigated and compared with single-die packages. The peak discharge current is not increased significantly by die stacking. The inter-die signal interfaces are shown to be well protected against CDM by placing just a small ESD protection clamp at the receiver, if certain package integration guidelines are followed.

Original language	English (US)
Title of host publication	2011 IEEE Custom Integrated Circuits Conference, CICC 2011
DOIs	https://doi.org/10.1109/CICC.2011.6055359
State	Published - 2011
Event	33rd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2011 - San Jose, CA, United States Duration: Sep 19 2011 → Sep 21 2011

Publication series

Name	Proceedings of the Custom Integrated Circuits Conference
ISSN (Print)	0886-5930

Other

Other	33rd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2011
Country/Territory	United States
City	San Jose, CA
Period	9/19/11 → 9/21/11

ASJC Scopus subject areas

Electrical and Electronic Engineering

Online availability

10.1109/CICC.2011.6055359

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Olson, N, Jack, N, Shukla, V & Rosenbaum, E 2011, CDM-ESD induced damage in components using stacked-die packaging. in 2011 IEEE Custom Integrated Circuits Conference, CICC 2011., 6055359, Proceedings of the Custom Integrated Circuits Conference, 33rd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2011, San Jose, CA, United States, 9/19/11. https://doi.org/10.1109/CICC.2011.6055359

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abstract = "CDM-ESD robustness of stacked-die packages is investigated and compared with single-die packages. The peak discharge current is not increased significantly by die stacking. The inter-die signal interfaces are shown to be well protected against CDM by placing just a small ESD protection clamp at the receiver, if certain package integration guidelines are followed.",

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year = "2011",

doi = "10.1109/CICC.2011.6055359",

language = "English (US)",

isbn = "9781457702228",

series = "Proceedings of the Custom Integrated Circuits Conference",

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AB - CDM-ESD robustness of stacked-die packages is investigated and compared with single-die packages. The peak discharge current is not increased significantly by die stacking. The inter-die signal interfaces are shown to be well protected against CDM by placing just a small ESD protection clamp at the receiver, if certain package integration guidelines are followed.

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T3 - Proceedings of the Custom Integrated Circuits Conference

BT - 2011 IEEE Custom Integrated Circuits Conference, CICC 2011

T2 - 33rd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2011

Y2 - 19 September 2011 through 21 September 2011

ER -

CDM-ESD induced damage in components using stacked-die packaging

Abstract

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