CDM-ESD induced damage in components using stacked-die packaging

Nicholas Olson, Nathan Jack, Vrashank Shukla, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

CDM-ESD robustness of stacked-die packages is investigated and compared with single-die packages. The peak discharge current is not increased significantly by die stacking. The inter-die signal interfaces are shown to be well protected against CDM by placing just a small ESD protection clamp at the receiver, if certain package integration guidelines are followed.

Original languageEnglish (US)
Title of host publication2011 IEEE Custom Integrated Circuits Conference, CICC 2011
DOIs
StatePublished - Nov 9 2011
Event33rd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2011 - San Jose, CA, United States
Duration: Sep 19 2011Sep 21 2011

Publication series

NameProceedings of the Custom Integrated Circuits Conference
ISSN (Print)0886-5930

Other

Other33rd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2011
CountryUnited States
CitySan Jose, CA
Period9/19/119/21/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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