Bidirectional reflection measurements of periodically microstructured silicon surfaces

Y. B. Chen, Q. Z. Zhu, T. L. Wright, W. P. King, Z. M. Zhang

Research output: Contribution to journalArticlepeer-review

Abstract

Surface modifications have a great potential for selective emission and absorption for applications in photonics, energy conversion, and biosensing. Pattern-induced radiative property changes can be an important issue in the manufacturing and diagnostics of microelectronic devices. This work investigates the polarized diffraction of micromachined silicon wafers. Both one-dimensional (1-D) and two-dimensional (2-D) periodic microstructures are manufactured by plasma-assisted anisotropic etching. The rotating mask method is used to produce 2.25 × 106 2-D structures in a single sample (7.5 × 7.5mm2). Surface topography is characterized by using a scanning electron microscope (SEM). A bidirectional scatterometer with high accuracy and angular resolution measures the diffraction patterns from the microstructured silicon surfaces at a wavelength of 635 nm. The diffraction patterns follow the grating equation, which are caused by microstructures and their orientations. Predicted diffraction angles are in excellent agreement with the experimental results.

Original languageEnglish (US)
Pages (from-to)1235-1252
Number of pages18
JournalInternational Journal of Thermophysics
Volume25
Issue number4
DOIs
StatePublished - Jul 1 2004
Externally publishedYes

Keywords

  • Bidirectional reflection
  • Diffraction
  • Grating
  • Scattering
  • Silicon microstructures

ASJC Scopus subject areas

  • Condensed Matter Physics

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