BestFit: A SPICE-compatible model for efficient, passive, broadband transmission-line analysis of dispersive interconnects

Anne Woo, Traianos Yioultsis', Andreas C Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

"BestFit" refers to a mathematical methodology used for the direct passive synthesis of SPICE-compatible models of multi-conductor interconnect structures. Given the bandwidth of simulation, the length of the interconnect system, and its per-unit-length, frequency-dependent resistance, inductance, capacitance and conductance matrices, the proposed algorithm synthesizes a compact, multi-port, dispersive, SPICE-compatible model for the interconnect. The resulting model is in terms of a concatenation of a number of non-uniform segments of lumped passive circuit representations of the per-unit-length series impedance and shunts admittance matrices, the lengths of which are obtained as a result of a Padi-Chebyshev approximation of the frequency-dependent input impedance matrix of the multiconductor transmission line system. The synthesized circuit is "optimal" in the sense that highly-Accurate responses can be obtained with a number of segments per minimum wavelength barely exceeding theNyquist limit of 2.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages255-258
Number of pages4
ISBN (Electronic)0780381289, 9780780381285
DOIs
StatePublished - Jan 1 2003
EventElectrical Performance of Electronic Packaging, 2003 - Princeton, United States
Duration: Oct 27 2003Oct 29 2003

Publication series

NameElectrical Performance of Electronic Packaging

Other

OtherElectrical Performance of Electronic Packaging, 2003
CountryUnited States
CityPrinceton
Period10/27/0310/29/03

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

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    Woo, A., Yioultsis', T., & Cangellaris, A. C. (2003). BestFit: A SPICE-compatible model for efficient, passive, broadband transmission-line analysis of dispersive interconnects. In Electrical Performance of Electronic Packaging (pp. 255-258). [1250044] (Electrical Performance of Electronic Packaging). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.2003.1250044