Abstract
B-doped Si0.95Ge0.05(0 0 1) films were grown on Si(0 0 1) by gas-source molecular beam epitaxy in the surface-reaction-limited regime using Si2H6, Ge2H6, and B2H6. Incorporated B concentrations CB (5 x 1016 - 3 x 1019 cm-3) were found to increase linearly with increasing B2H6 flux JB2H6 (6 x 1012-2 x 1015 cm-2 s-1) at constant film growth temperature Ts, and to decrease exponentially with 1/Ts at constant JB2H6. The B2H6 reactive sticking probability ranged from ≃ 3.3 x 10-4 at Ts = 600°C to 8.2 x 10-4 at 700°C and film growth rates were independent of JB2A6. Structural analysis by in-situ reflection high-energy electron diffraction combined with post-deposition high-resolution plan-view and cross-sectional transmission electron microscopy, high-resolution X-ray diffraction, and reciprocal lattice mapping showed that all films were fully strained, with measured relaxations less than the detection limit, ≃ 3 x 10-5, and exhibited no evidence of dislocations or other extended defects. Room-temperature Si0.95Ge0.05 : B conductivity mobilities were equal to theoretical values and a factor of ≃ 2 higher than corresponding results for bulk Si. μc varied from 410 cm2 V-1 s-1 with CB = 5 x 1016 cm-3 to 60 cm2V-1s-1 with CB = 3 x 1019 cm-3.
Original language | English (US) |
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Pages (from-to) | 97-107 |
Number of pages | 11 |
Journal | Journal of Crystal Growth |
Volume | 179 |
Issue number | 1-2 |
DOIs | |
State | Published - Aug 1997 |
Keywords
- B incorporation
- Electronic properties
- Hole mobilities
- SiGe
- Strain
ASJC Scopus subject areas
- Condensed Matter Physics
- Inorganic Chemistry
- Materials Chemistry