Autonomic cooling of a substrate is achieved using a porous thermal protective layer to provide evaporative cooling combined with capillary pumping. The porous thermal protective layer is manufactured onto the substrate. A vascular network is integrated between the substrate and the protective layer. Applied heat causes fluid contained in the protective layer to evaporate, removing heat. The fluid lost to evaporation is replaced by capillary pressure, pulling fluid from a fluid-containing reservoir through the vascular network. Cooling occurs as liquid evaporates from the protective layer.
Original languageEnglish (US)
U.S. patent number10539346
StatePublished - Jan 21 2020


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