Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling

Tymon Barwicz, Nicolas Boyer, Stephane Harel, Ted W. Lichoulas, Eddie L. Kimbrell, Alexander Janta-Polczynski, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Silicon photonics technology aims to leverage microelectronic chip fabrication facilities to bring disruptive advancements in photonic circuits cost and complexity. However, the large scale deployment of silicon photonics is muted by the difficulty of cost-efficient and scalable, singlemode optical inputs and outputs. To disruptively improve on cost and scalability, we believe that the best approach is to enable existing high-throughput microelectronic packaging tools for single-mode photonic packaging. In this paper, we experimentally demonstrate such approach with automated assembly of standard-fiber arrays to photonic chips. We identify the main challenges and solutions to enabling highthroughput pick-and-place tooling for single-mode photonic assembly. These include challenges with fiber handling, placement accuracy and limitations in movement complexity. We present a manufacturability assessment of the employed fiber-to-chip self-alignment. We show through Monte Carlo tolerance analysis an expected manufacturing re-alignment accuracy of <1.3 um despite initial misalignments of up to ∼40 um. We believe the approach proposed and demonstrated here can substantially improve on single-mode optical input and output cost and scalability.

Original languageEnglish (US)
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages775-782
Number of pages8
ISBN (Electronic)9781479986095
DOIs
StatePublished - Jul 15 2015
Externally publishedYes
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: May 26 2015May 29 2015

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period5/26/155/29/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Barwicz, T., Boyer, N., Harel, S., Lichoulas, T. W., Kimbrell, E. L., Janta-Polczynski, A., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2015). Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015 (pp. 775-782). [7159680] (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159680