Abstract
Heat conduction governs the ultimate writing and reading capabilities of a thermomechanical data storage device. This work investigates transient heat conduction in a resistively heated atomic force microscope cantilever through measurement and simulation of cantilever thermal and electrical behavior. The time required to heat a single cantilever to bit-writing temperature is near 1 μs and the thermal data reading sensitivity ΔR/R is near 1 × 10-4 per vertical nm. Finite-difference thermal and electrical simulation results compare well with electrical measurements during writing and reading, indicating design tradeoffs in power requirements, data writing speed, and data reading sensitivity. We present a design for a proposed cantilever that is predicted to be faster and more sensitive than the present cantilever.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1300-1302 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 78 |
| Issue number | 9 |
| DOIs | |
| State | Published - Feb 26 2001 |
| Externally published | Yes |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)