TY - GEN
T1 - Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
AU - Barwicz, Tymon
AU - Taira, Yoichi
AU - Numata, Hidetoshi
AU - Boyer, Nicolas
AU - Harel, Stephane
AU - Kamlapurkar, Swetha
AU - Takenobu, Shotaro
AU - Laflamme, Simon
AU - Engelmann, Sebastian
AU - Vlasov, Yurii
AU - Fortier, Paul
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/11
Y1 - 2014/9/11
N2 - Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by the difficulty of cost efficient optical inputs and outputs. To address this challenge, we have recently proposed a low-cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. Our concept promises better mechanical reliability and better optical performance than existing technology. To manage the cost of assembly, we show here that self-alignment features can be effectively used to bridge the gap between the accuracy required by single-mode optics (1-2 um) and the capability of high-throughput microelectronic assembly equipment (∼10 um). We describe the complaint interface, the assembly strategy, and the design of our re-alignment features. We demonstrate experimentally that misalignments at assembly as large as +/-10 um are re-aligned by our self-alignment structures to +/-1 to 2 um. Our approach enables existing microelectronics equipment to be used for singlemode optics assembly.
AB - Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by the difficulty of cost efficient optical inputs and outputs. To address this challenge, we have recently proposed a low-cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. Our concept promises better mechanical reliability and better optical performance than existing technology. To manage the cost of assembly, we show here that self-alignment features can be effectively used to bridge the gap between the accuracy required by single-mode optics (1-2 um) and the capability of high-throughput microelectronic assembly equipment (∼10 um). We describe the complaint interface, the assembly strategy, and the design of our re-alignment features. We demonstrate experimentally that misalignments at assembly as large as +/-10 um are re-aligned by our self-alignment structures to +/-1 to 2 um. Our approach enables existing microelectronics equipment to be used for singlemode optics assembly.
UR - https://www.scopus.com/pages/publications/84907900577
UR - https://www.scopus.com/pages/publications/84907900577#tab=citedBy
U2 - 10.1109/ECTC.2014.6897286
DO - 10.1109/ECTC.2014.6897286
M3 - Conference contribution
AN - SCOPUS:84907900577
T3 - Proceedings - Electronic Components and Technology Conference
SP - 179
EP - 185
BT - Proceedings - Electronic Components and Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 64th Electronic Components and Technology Conference, ECTC 2014
Y2 - 27 May 2014 through 30 May 2014
ER -