Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips

Tymon Barwicz, Yoichi Taira, Hidetoshi Numata, Nicolas Boyer, Stephane Harel, Swetha Kamlapurkar, Shotaro Takenobu, Simon Laflamme, Sebastian Engelmann, Yurii A Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by the difficulty of cost efficient optical inputs and outputs. To address this challenge, we have recently proposed a low-cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. Our concept promises better mechanical reliability and better optical performance than existing technology. To manage the cost of assembly, we show here that self-alignment features can be effectively used to bridge the gap between the accuracy required by single-mode optics (1-2 um) and the capability of high-throughput microelectronic assembly equipment (∼10 um). We describe the complaint interface, the assembly strategy, and the design of our re-alignment features. We demonstrate experimentally that misalignments at assembly as large as +/-10 um are re-aligned by our self-alignment structures to +/-1 to 2 um. Our approach enables existing microelectronics equipment to be used for singlemode optics assembly.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages179-185
Number of pages7
ISBN (Electronic)9781479924073
DOIs
StatePublished - Sep 11 2014
Externally publishedYes
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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