Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond

Jin Hyun Kim; Shin Haeng Kang; Sukhan Lee; Hyeonsu Kim; Woongjae Song; Yuhwan Ro; Seungwon Lee; David Wang; Hyunsung Shin; Bengseng Phuah; Jihyun Choi; Jinin So; Yeongon Cho; Joonho Song; Jangseok Choi; Jeonghyeon Cho; Kyomin Sohn; Youngsoo Sohn; Kwangil Park; Nam Sung Kim

doi:10.1109/HCS52781.2021.9567191

Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond

Jin Hyun Kim, Shin Haeng Kang, Sukhan Lee, Hyeonsu Kim, Woongjae Song, Yuhwan Ro, Seungwon Lee, David Wang, Hyunsung Shin, Bengseng Phuah, Jihyun Choi, Jinin So, Yeongon Cho, Joonho Song, Jangseok Choi, Jeonghyeon Cho, Kyomin Sohn, Youngsoo Sohn, Kwangil Park, Nam Sung Kim

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	2021 IEEE Hot Chips 33 Symposium, HCS 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665413978
DOIs	https://doi.org/10.1109/HCS52781.2021.9567191
State	Published - Aug 22 2021
Externally published	Yes
Event	2021 IEEE Hot Chips 33 Symposium, HCS 2021 - Palo Alto, United States Duration: Aug 22 2021 → Aug 24 2021

Publication series

Name	2021 IEEE Hot Chips 33 Symposium, HCS 2021

Conference

Conference	2021 IEEE Hot Chips 33 Symposium, HCS 2021
Country/Territory	United States
City	Palo Alto
Period	8/22/21 → 8/24/21

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Online availability

10.1109/HCS52781.2021.9567191

Library availability

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Kim, J. H., Kang, S. H., Lee, S., Kim, H., Song, W., Ro, Y., Lee, S., Wang, D., Shin, H., Phuah, B., Choi, J., So, J., Cho, Y., Song, J., Choi, J., Cho, J., Sohn, K., Sohn, Y., Park, K., & Kim, N. S. (2021). Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond. In 2021 IEEE Hot Chips 33 Symposium, HCS 2021 (2021 IEEE Hot Chips 33 Symposium, HCS 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/HCS52781.2021.9567191

Aquabolt-XL : Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond. / Kim, Jin Hyun; Kang, Shin Haeng; Lee, Sukhan et al.

2021 IEEE Hot Chips 33 Symposium, HCS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. (2021 IEEE Hot Chips 33 Symposium, HCS 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kim, JH, Kang, SH, Lee, S, Kim, H, Song, W, Ro, Y, Lee, S, Wang, D, Shin, H, Phuah, B, Choi, J, So, J, Cho, Y, Song, J, Choi, J, Cho, J, Sohn, K, Sohn, Y, Park, K & Kim, NS 2021, Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond. in 2021 IEEE Hot Chips 33 Symposium, HCS 2021. 2021 IEEE Hot Chips 33 Symposium, HCS 2021, Institute of Electrical and Electronics Engineers Inc., 2021 IEEE Hot Chips 33 Symposium, HCS 2021, Palo Alto, United States, 8/22/21. https://doi.org/10.1109/HCS52781.2021.9567191

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title = "Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond",

author = "Kim, {Jin Hyun} and Kang, {Shin Haeng} and Sukhan Lee and Hyeonsu Kim and Woongjae Song and Yuhwan Ro and Seungwon Lee and David Wang and Hyunsung Shin and Bengseng Phuah and Jihyun Choi and Jinin So and Yeongon Cho and Joonho Song and Jangseok Choi and Jeonghyeon Cho and Kyomin Sohn and Youngsoo Sohn and Kwangil Park and Kim, {Nam Sung}",

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doi = "10.1109/HCS52781.2021.9567191",

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AU - Kim, Jin Hyun

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AU - Lee, Sukhan

AU - Kim, Hyeonsu

AU - Song, Woongjae

AU - Ro, Yuhwan

AU - Lee, Seungwon

AU - Wang, David

AU - Shin, Hyunsung

AU - Phuah, Bengseng

AU - Choi, Jihyun

AU - So, Jinin

AU - Cho, Yeongon

AU - Song, Joonho

AU - Choi, Jangseok

AU - Cho, Jeonghyeon

AU - Sohn, Kyomin

AU - Sohn, Youngsoo

AU - Park, Kwangil

AU - Kim, Nam Sung

PY - 2021/8/22

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M3 - Conference contribution

AN - SCOPUS:85118376165

T3 - 2021 IEEE Hot Chips 33 Symposium, HCS 2021

BT - 2021 IEEE Hot Chips 33 Symposium, HCS 2021

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 22 August 2021 through 24 August 2021

ER -

Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond

Publication series

Conference

ASJC Scopus subject areas

Online availability

Library availability

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