Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond

Jin Hyun Kim, Shin Haeng Kang, Sukhan Lee, Hyeonsu Kim, Woongjae Song, Yuhwan Ro, Seungwon Lee, David Wang, Hyunsung Shin, Bengseng Phuah, Jihyun Choi, Jinin So, Yeongon Cho, Joonho Song, Jangseok Choi, Jeonghyeon Cho, Kyomin Sohn, Youngsoo Sohn, Kwangil Park, Nam Sung Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publication2021 IEEE Hot Chips 33 Symposium, HCS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665413978
StatePublished - Aug 22 2021
Externally publishedYes
Event2021 IEEE Hot Chips 33 Symposium, HCS 2021 - Palo Alto, United States
Duration: Aug 22 2021Aug 24 2021

Publication series

Name2021 IEEE Hot Chips 33 Symposium, HCS 2021


Conference2021 IEEE Hot Chips 33 Symposium, HCS 2021
Country/TerritoryUnited States
CityPalo Alto

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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