@inproceedings{e1cd175fdcaf4a628bb881a5f27c2f4c,
title = "Application of the latency insertion method to electro-thermal circuit analysis",
abstract = "In this paper, a fast circuit simulation technique based on the Latency Insertion Method (LIM) is proposed for the electro-thermal analysis of circuits and high-performance systems. The method is applied to the modeling of on-chip and off-chip 3D-interconnect networks. The proposed method is shown to be capable of modeling both electrical and thermal phenomena occurring in high speed, high performance VLSI circuits at the pre-layout design stages.",
keywords = "IR drop, circuit simulation, electro-thermal analysis, latency insertion, power integrity",
author = "D. Klokotov and J. Schutt-Ain{\'e} and W. Beyene and D. Mullen and M. Li and R. Schmitt and L. Yang",
year = "2011",
doi = "10.1109/EPEPS.2011.6100242",
language = "English (US)",
isbn = "9781424493999",
series = "2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011",
pages = "263--266",
booktitle = "2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011",
note = "2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 ; Conference date: 23-10-2011 Through 26-10-2011",
}