Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint

Haifei Zhou, Jingdong Guo, Qingsheng Zhu, Jianku Shang

Research output: Contribution to journalArticle

Abstract

Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fe-42Ni(P) alloy may become an attractive under-bump metallization (UBM).

Original languageEnglish (US)
Pages (from-to)7-12
Number of pages6
JournalJournal of Materials Science and Technology
Volume29
Issue number1
DOIs
StatePublished - Jan 1 2013

Keywords

  • Electroless Fe-42Ni(P)
  • Interfacial reaction
  • Sn
  • Solderability
  • Under-bump metallization (UBM)

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Polymers and Plastics
  • Metals and Alloys
  • Materials Chemistry

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