Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint

Haifei Zhou; Jingdong Guo; Qingsheng Zhu; Jianku Shang

doi:10.1016/j.jmst.2012.12.006

Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint

Haifei Zhou, Jingdong Guo, Qingsheng Zhu, Jianku Shang

Research output: Contribution to journal › Article › peer-review

Abstract

Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni²⁺ and Fe²⁺. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fe-42Ni(P) alloy may become an attractive under-bump metallization (UBM).

Original language	English (US)
Pages (from-to)	7-12
Number of pages	6
Journal	Journal of Materials Science and Technology
Volume	29
Issue number	1
DOIs	https://doi.org/10.1016/j.jmst.2012.12.006
State	Published - Jan 2013
Externally published	Yes

Keywords

Electroless Fe-42Ni(P)
Interfacial reaction
Sn
Solderability
Under-bump metallization (UBM)

ASJC Scopus subject areas

Ceramics and Composites
Mechanics of Materials
Mechanical Engineering
Polymers and Plastics
Metals and Alloys
Materials Chemistry

Online availability

10.1016/j.jmst.2012.12.006

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title = "Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint",

abstract = "Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fe-42Ni(P) alloy may become an attractive under-bump metallization (UBM).",

keywords = "Electroless Fe-42Ni(P), Interfacial reaction, Sn, Solderability, Under-bump metallization (UBM)",

author = "Haifei Zhou and Jingdong Guo and Qingsheng Zhu and Jianku Shang",

note = "Funding Information: This work was supported by the National Basic Research Program of China (No. 2004CB619306 ), the National Natural Science Foundation of China (Nos. 51171191 and 51101161 ), and the Major National Science and Technology Program of China (No. 2011ZX02602 ).",

year = "2013",

month = jan,

doi = "10.1016/j.jmst.2012.12.006",

language = "English (US)",

volume = "29",

pages = "7--12",

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issn = "1005-0302",

publisher = "Chinese Society of Metals",

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T1 - Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint

AU - Zhou, Haifei

AU - Guo, Jingdong

AU - Zhu, Qingsheng

AU - Shang, Jianku

N1 - Funding Information: This work was supported by the National Basic Research Program of China (No. 2004CB619306 ), the National Natural Science Foundation of China (Nos. 51171191 and 51101161 ), and the Major National Science and Technology Program of China (No. 2011ZX02602 ).

PY - 2013/1

Y1 - 2013/1

N2 - Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fe-42Ni(P) alloy may become an attractive under-bump metallization (UBM).

AB - Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni(P) electroless deposit was prepared by using disodium ethylene diamine tetraacetate (ETDA-2Na) as complexing agent to reduce the difference in the electrode potential between Ni2+ and Fe2+. The solderability and the interfacial reaction between Fe-42Ni(P) alloy and Sn were investigated. It was found that the electroless Fe-42Ni(P) alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni(P) and Sn is very slow. These results suggest that Fe-42Ni(P) alloy may become an attractive under-bump metallization (UBM).

KW - Electroless Fe-42Ni(P)

KW - Interfacial reaction

KW - Sn

KW - Solderability

KW - Under-bump metallization (UBM)

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Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint

Abstract

Keywords

ASJC Scopus subject areas

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