Abstract
A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.
Original language | English (US) |
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Pages | 281-284 |
Number of pages | 4 |
State | Published - 2004 |
Event | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004 |
Other
Other | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
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Country/Territory | United States |
City | Portland, OR |
Period | 10/25/04 → 10/27/04 |
ASJC Scopus subject areas
- General Engineering