Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives

Hong Wu, Andreas C. Cangellaris, An Yu Kuo

Research output: Contribution to conferencePaperpeer-review

Abstract

A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.

Original languageEnglish (US)
Pages281-284
Number of pages4
StatePublished - Dec 1 2004
EventIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States
Duration: Oct 25 2004Oct 27 2004

Other

OtherIEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityPortland, OR
Period10/25/0410/27/04

ASJC Scopus subject areas

  • Engineering(all)

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