Application of a new method to quantify local air-side heat transfer coefficient on fundamental geometries

Min Che, Stefan Elbel

Research output: Chapter in Book/Report/Conference proceedingConference contribution


A new optical method based on the analogy between heat and mass transfer is developed to obtain local air-side heat transfer coefficient (HTC). It uses thin-film coatings applied to the heat transfer surface in combination with a tracer gas. Experiments with fundamental geometries were conducted to calibrate the process and evaluate its accuracy. The local air-side HTCs results for laminar flow over a flat plate are within 20% compared to the Blasius solution except for the leading and trailing edges. The mass transfer experiments are conducted in a wind tunnel. Calibration for the flat plate experiments takes into account flow velocity, light source, relative humidity of air, tracer gas concentration, and sample aging effects. Correlations for these parameters have been established. The measurements of the basic geometries such as inclined plates, wedges, and cylinders agree with the experimental results of literatures which employed different methods. These promising validation experiments justify the exploration of more complex geometries and entire heat exchangers using this technique.

Original languageEnglish (US)
Title of host publicationICR 2019 - 25th IIR International Congress of Refrigeration
EditorsVasile Minea
PublisherInternational Institute of Refrigeration
Number of pages8
ISBN (Electronic)9782362150357
StatePublished - 2019
Event25th IIR International Congress of Refrigeration, ICR 2019 - Montreal, Canada
Duration: Aug 24 2019Aug 30 2019

Publication series

NameRefrigeration Science and Technology
ISSN (Print)0151-1637


Conference25th IIR International Congress of Refrigeration, ICR 2019


  • Coating
  • Heat
  • Laminar Flow
  • Local HTC
  • Mass Transfer
  • Mass Transfer Analogy
  • Tracer Gas

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics


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