Application level investigation of system-level ESD-induced soft failures

Sandeep Vora, Rui Jiang, Shobha Vasudevan, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Hardware and application level manifestations of ESD soft failures were characterized for a singleboard computer and similar products. Failures associated with the peripheral ICs occur independent of the application being run; the application-dependent failures are attributed to noise at the CPU.

Original languageEnglish (US)
Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016
PublisherESD Association
ISBN (Electronic)9781585372898
DOIs
StatePublished - Oct 14 2016
Event38th Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2016 - Garden Grove (Anaheim), United States
Duration: Sep 11 2016Sep 16 2016

Publication series

NameElectrical Overstress/Electrostatic Discharge Symposium Proceedings
Volume2016-October
ISSN (Print)0739-5159

Other

Other38th Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2016
CountryUnited States
CityGarden Grove (Anaheim)
Period9/11/169/16/16

Fingerprint

Program processors
Hardware

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Vora, S., Jiang, R., Vasudevan, S., & Rosenbaum, E. (2016). Application level investigation of system-level ESD-induced soft failures. In Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016 [7592565] (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; Vol. 2016-October). ESD Association. https://doi.org/10.1109/EOSESD.2016.7592565

Application level investigation of system-level ESD-induced soft failures. / Vora, Sandeep; Jiang, Rui; Vasudevan, Shobha; Rosenbaum, Elyse.

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016. ESD Association, 2016. 7592565 (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; Vol. 2016-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vora, S, Jiang, R, Vasudevan, S & Rosenbaum, E 2016, Application level investigation of system-level ESD-induced soft failures. in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016., 7592565, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, vol. 2016-October, ESD Association, 38th Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2016, Garden Grove (Anaheim), United States, 9/11/16. https://doi.org/10.1109/EOSESD.2016.7592565
Vora S, Jiang R, Vasudevan S, Rosenbaum E. Application level investigation of system-level ESD-induced soft failures. In Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016. ESD Association. 2016. 7592565. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings). https://doi.org/10.1109/EOSESD.2016.7592565
Vora, Sandeep ; Jiang, Rui ; Vasudevan, Shobha ; Rosenbaum, Elyse. / Application level investigation of system-level ESD-induced soft failures. Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016. ESD Association, 2016. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).
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