Abstract

According to example embodiments of the invention, a microscale testing stage comprises a frame having first and second opposing ends and first and second side beams, at least one deformable force sensor beam, a first longitudinal beam having a free end, a second longitudinal beam having a facing free end, a support structure, and a pair of slots disposed at each of the free ends. In certain embodiments, a layer of a conductive material defines first and second conductive paths and an open circuit that can be closed by the specimen across the gap. In other embodiments, the stage is formed of a high melting temperature material.
Original languageEnglish (US)
U.S. patent number9019512
StatePublished - Apr 28 2015

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