Anisotropic Chemical Etching of Copper Foil: II. Experimental Studies on Shape Evolution

Keyphrases

• Anisotropic Etching 100%
• Chemical Etching 33%
• Chloride Solution 33%
• Copper Chloride 66%
• Copper Foil 100%
• Cupric Chloride 33%
• Etch Profile 33%
• Etching Rate 100%
• Etching Solution 66%
• Flow Pattern 33%
• Fluid Velocity 33%
• Local Mass Transfer 33%
• Mass Transfer 33%
• Mass Transfer Rate 33%
• Microhydrodynamics 33%
• Peclet number 33%
• Photoresist 33%
• Product Removal 33%
• Salt Film 33%
• Shape Evolution 100%
• Surface Roughness 33%

Material Science

• Chemical Etching 100%
• Chloride 33%
• Film 100%
• Salt Film 33%
• Surface Roughness 33%
• Wet Etching 33%

Chemical Engineering

• Film 100%
• Mass Transport 50%
• Peclet Number 25%