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Anisotropic Chemical Etching of Copper Foil: II. Experimental Studies on Shape Evolution
Maria Georgiadou,
Richard Alkire
Chemical and Biomolecular Engineering
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peer-review
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Dive into the research topics of 'Anisotropic Chemical Etching of Copper Foil: II. Experimental Studies on Shape Evolution'. Together they form a unique fingerprint.
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Keyphrases
Shape Evolution
100%
Etching Rate
100%
Anisotropic Etching
100%
Copper Foil
100%
Copper Chloride
66%
Etching Solution
66%
Cupric Chloride
33%
Mass Transfer
33%
Surface Roughness
33%
Photoresist
33%
Chloride Solution
33%
Chemical Etching
33%
Flow Pattern
33%
Fluid Velocity
33%
Etch Profile
33%
Peclet number
33%
Product Removal
33%
Mass Transfer Rate
33%
Local Mass Transfer
33%
Salt Film
33%
Microhydrodynamics
33%
Engineering
Anisotropic
100%
Etch Rate
100%
Copper Foil
100%
Inflow Rate
33%
Photoresist
33%
Fluid Velocity
33%
Peclet Number
33%
Mass Transfer Rate
33%
Flow Distribution
33%
Material Science
Film
100%
Surface (Surface Science)
100%
Wet Etching
33%
Surface Roughness
33%
Salt Film
33%
Chemical Engineering
Film
100%
Peclet Number
25%