Analyzing the performance and energy impact of 3D memory integration on embedded DSPs

Daniel W. Chang, Nam S. Kim, Michael J. Schulte

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, three-dimensional integration technology has allowed researchers and designers to explore novel architectures for computing systems. Due to the memory-intensive nature of signal processing systems, DSPs can greatly benefit from 3D memory integration technology realized by vertically stacking high-density memory below processing cores. In this paper, we analyze the energy and performance impacts of 3D memory integration in DSP systems by exploring a wide variety of memory configurations the technology enables. Our analysis demonstrates that a 3D memory hierarchy can increase performance by an average of 20.6% while decreasing energy by 6.7% when compared to our baseline 2D memory hierarchy, with a processor similar to a Texas Instrument C67x DSP. This proposed memory architecture also allows us to scale the voltage and frequency to decrease energy consumption by an average of 23% without decreasing performance.

Original languageEnglish (US)
Title of host publicationProceedings - 2011 International Conference on Embedded Computer Systems
Subtitle of host publicationArchitectures, Modeling and Simulation, IC-SAMOS 2011
Pages303-310
Number of pages8
DOIs
StatePublished - Nov 7 2011
Externally publishedYes
Event2011 11th International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation, IC-SAMOS 2011 - Samos, Greece
Duration: Jul 18 2011Jul 21 2011

Publication series

NameProceedings - 2011 International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation, IC-SAMOS 2011

Other

Other2011 11th International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation, IC-SAMOS 2011
CountryGreece
CitySamos
Period7/18/117/21/11

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Modeling and Simulation

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