Analysis of IR-drop in 3-D IC packaging using a non-conformal domain decomposition method

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we present a non-conformal, non-overlapping domain decomposition method (DDM) for the IR drop analysis of high-power integrated circuit (IC) package in which both dielectrics and non-ideal conductors coexist. The proposed non-conformal DDM starts by partitioning the composite device into inhomogeneous sub-regions. Subsequently, each sub-domain is meshed independently according to its own characteristic features. As a consequence, the troublesome mesh generation task for complex ICs can be greatly relaxed. The proposed non-conformal DDM has been applied to analyze the IR drops in the power delivery networks (PDNs) of complex ICs. Numerical results of a product-level IC package demonstrate the flexibility and potentials of the non-conformal DDM.

Original languageEnglish (US)
Title of host publication2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings
Pages405-408
Number of pages4
DOIs
StatePublished - Aug 15 2012
Externally publishedYes
Event2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Singapore, Singapore
Duration: May 21 2012May 24 2012

Publication series

Namecccc2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings

Conference

Conference2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012
CountrySingapore
CitySingapore
Period5/21/125/24/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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