TY - GEN
T1 - Analysis of IR-drop in 3-D IC packaging using a non-conformal domain decomposition method
AU - Shao, Yang
AU - Peng, Zhen
AU - Lee, Jin Fa
PY - 2012
Y1 - 2012
N2 - In this paper, we present a non-conformal, non-overlapping domain decomposition method (DDM) for the IR drop analysis of high-power integrated circuit (IC) package in which both dielectrics and non-ideal conductors coexist. The proposed non-conformal DDM starts by partitioning the composite device into inhomogeneous sub-regions. Subsequently, each sub-domain is meshed independently according to its own characteristic features. As a consequence, the troublesome mesh generation task for complex ICs can be greatly relaxed. The proposed non-conformal DDM has been applied to analyze the IR drops in the power delivery networks (PDNs) of complex ICs. Numerical results of a product-level IC package demonstrate the flexibility and potentials of the non-conformal DDM.
AB - In this paper, we present a non-conformal, non-overlapping domain decomposition method (DDM) for the IR drop analysis of high-power integrated circuit (IC) package in which both dielectrics and non-ideal conductors coexist. The proposed non-conformal DDM starts by partitioning the composite device into inhomogeneous sub-regions. Subsequently, each sub-domain is meshed independently according to its own characteristic features. As a consequence, the troublesome mesh generation task for complex ICs can be greatly relaxed. The proposed non-conformal DDM has been applied to analyze the IR drops in the power delivery networks (PDNs) of complex ICs. Numerical results of a product-level IC package demonstrate the flexibility and potentials of the non-conformal DDM.
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U2 - 10.1109/APEMC.2012.6237966
DO - 10.1109/APEMC.2012.6237966
M3 - Conference contribution
AN - SCOPUS:84864829894
SN - 9781457715587
T3 - cccc2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings
SP - 405
EP - 408
BT - 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings
T2 - 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012
Y2 - 21 May 2012 through 24 May 2012
ER -