Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications

J. F. Stubbins, P. Kurath, D. Drockelman, G. D. Morgan, J. McAfee, G. Li, B. G. Thomas

Research output: Contribution to conferencePaper

Abstract

The mechanical performance of bi-layer copper alloy (Glidcop CuA116) to 316L stainless steel panels was examined. This work was to analyze potential bonding methodologies for the fabrication of ITER first wall structures, to verify the bond integrity of the fabricated panels, and to establish some mechanical performance parameters for panel structural performance. Two bonding routes were examined: examined bonding and hot isostatically pressed (HIP) bonding. Following fabrication, the panels were mechanically loaded in tensile and fatigue tests. The mechanical performance test verified that the bond integrity was excellent, and that the primary mode of failure of the bonded panels was related to failure in the base materials rather than lack of adequate bond strength.

Original languageEnglish (US)
Pages174-177
Number of pages4
StatePublished - Dec 1 1995
EventProceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2) - Champaign, IL, USA
Duration: Oct 1 1995Oct 5 1995

Other

OtherProceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2)
CityChampaign, IL, USA
Period10/1/9510/5/95

Fingerprint

copper alloys
Copper alloys
stainless steels
Stainless steel
integrity
Structural panels
Fabrication
fabrication
fatigue tests
performance tests
tensile tests
Fatigue of materials
routes
methodology

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Nuclear Energy and Engineering

Cite this

Stubbins, J. F., Kurath, P., Drockelman, D., Morgan, G. D., McAfee, J., Li, G., & Thomas, B. G. (1995). Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications. 174-177. Paper presented at Proceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2), Champaign, IL, USA, .

Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications. / Stubbins, J. F.; Kurath, P.; Drockelman, D.; Morgan, G. D.; McAfee, J.; Li, G.; Thomas, B. G.

1995. 174-177 Paper presented at Proceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2), Champaign, IL, USA, .

Research output: Contribution to conferencePaper

Stubbins, JF, Kurath, P, Drockelman, D, Morgan, GD, McAfee, J, Li, G & Thomas, BG 1995, 'Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications', Paper presented at Proceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2), Champaign, IL, USA, 10/1/95 - 10/5/95 pp. 174-177.
Stubbins JF, Kurath P, Drockelman D, Morgan GD, McAfee J, Li G et al. Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications. 1995. Paper presented at Proceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2), Champaign, IL, USA, .
Stubbins, J. F. ; Kurath, P. ; Drockelman, D. ; Morgan, G. D. ; McAfee, J. ; Li, G. ; Thomas, B. G. / Analysis of copper alloy to stainless steel bonded panels for ITER first wall applications. Paper presented at Proceedings of the 1995 16th IEEE/NPSS Symposium on Fusion Engineering. Part 1 (of 2), Champaign, IL, USA, .4 p.
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