Abstract
An active rail clamp circuit provides protection against component-level ESD; this work explores the challenges associated with designing a rail clamp to additionally provide protection when the IC is powered on. The fast transient response required to protect against ESD makes it difficult to design a stable circuit and introduces tradeoffs between supply integrity and the clamping characteristic. This work presents an analysis of how these performance metrics are affected by device sizes. Interactions between a rail clamp circuit, which may be an active or passive clamp, and the parasitic elements of the package and board are examined; it is shown that these interactions may briefly power down the supply.
Original language | English (US) |
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Article number | 7177068 |
Pages (from-to) | 263-271 |
Number of pages | 9 |
Journal | IEEE Transactions on Device and Materials Reliability |
Volume | 15 |
Issue number | 3 |
DOIs | |
State | Published - Sep 1 2015 |
Keywords
- Circuit stability
- Electromagnetic compatibility
- Electrostatic discharge
- Immunity testing
- Integrated circuit reliability
- System-level ESD
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Safety, Risk, Reliability and Quality
- Electrical and Electronic Engineering