The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In the past two decades, researchers in the electromagnetic and microwave areas have strived to extend the knowledge of interconnection properties. Their efforts have resulted in models and analytical methods without which the development of reliable design tools would be impossible. Packaging and interconnects nowadays represent a critical area for the design of high-performance digital systems, and the work of these contributors is invaluable. This paper exposes the state-of-the-art in packaging technology and reviews the important steps in the development of analytical models, numerical methods and simulation techniques for the design of high-speed interconnections.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering