Analyses of high speed interconnects using a non-conformal domain decomposition method

Zhen Peng, Yang Shao, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An efficient non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of high-speed interconnections on multi-layer printed circuit board (PCB) in this paper.

Original languageEnglish (US)
Title of host publication2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
Pages504-507
Number of pages4
DOIs
StatePublished - Aug 2 2010
Externally publishedYes
Event2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010 - Beijing, China
Duration: Apr 12 2010Apr 16 2010

Publication series

Name2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010

Other

Other2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010
CountryChina
CityBeijing
Period4/12/104/16/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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