An SH0 lithium niobate trans-impedance chirp compressor with high voltage gain

Tomas Manzaneque, Ruochen Lu, Yansong Yang, Songbin Gong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a new type of acoustic devices that, for the first time, can simultaneously perform chirp compression and impedance transformation to achieve passive voltage amplification with a gain of 12. The device consists of an acoustic dispersive delay line (DDL) based on shear-horizontal waves (SH0) in lithium niobate (LiNbO3). SH0 waves are employed due to their demonstrated high electromechanical coupling (k2) of 39%, low propagation loss, and a slow phase velocity of 3700 m/s. As a result of these desirable features, the fabricated device demonstrates a large fractional bandwidth (FBW) of 50%, a low insertion loss (IL), a high processing gain (TB) of 76, and a compact size of 1.57 by 0.23 mm. In addition to the compression, the device harnesses an asymmetrical transduction scheme to provide a compounding voltage gain from impedance transformation. Consequently, it results in a much higher voltage at the device output, which can be exploited to attain a higher sensitivity for wake-up radio receivers.

Original languageEnglish (US)
Title of host publication2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages783-786
Number of pages4
ISBN (Electronic)9781538647820
DOIs
StatePublished - Apr 24 2018
Event31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018 - Belfast, United Kingdom
Duration: Jan 21 2018Jan 25 2018

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2018-January
ISSN (Print)1084-6999

Other

Other31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Country/TerritoryUnited Kingdom
CityBelfast
Period1/21/181/25/18

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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