An SH0 Lithium Niobate dispersive delay line for chirp compression-enabled low power radios

Tomas Manzaneque, Ruochen Lu, Yansong Yang, Songbin Gong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the first demonstration of a shear-horizontal mode Lithium Niobate dispersive delay line, featuring a center frequency of 250 MHz, a delay-bandwidth (TB) product of 100, an electromechanical coupling (k2) in excess of 35%, and a low insertion loss of 10 dB. The high compression is attained via a large bandwidth of 125 MHz, centered at 250 MHz, and an extensive delay of 0.8 μS. The device shown herein has greatly outperformed the state of the art, namely surface acoustic wave delay lines which typically have an insertion loss over 25 dB for a comparable compression ratio. The attained performance can be attributed to the excellent piezoelectric coupling of lamb waves in a suspended Lithium Niobate X-cut thin film. A voltage gain of 3 has been demonstrated for instantaneously amplifying chirp-coded signals, a feature that can be harnessed to enhance signal to noise ratio in low power wake-up radios for Internet of Things (IoT) applications.

Original languageEnglish (US)
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages155-158
Number of pages4
ISBN (Electronic)9781509050789
DOIs
StatePublished - Feb 23 2017
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: Jan 22 2017Jan 26 2017

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
CountryUnited States
CityLas Vegas
Period1/22/171/26/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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