@inproceedings{74ef1e8883b4432397b0011b7524c068,
title = "An Overview of Computer Modeling for Large EMC Chip and Package Problems",
abstract = "Recently, a substantial increase has been accomplished in the performance of VLSI based electronic systems. This has resulted in a major shift to a higher frequency spectrum for EMI design. The increased frequency spectrum has introduced numerous new challenging problems into the EMC design and verification areas. In this paper, we give an overview over the issues which have to be considered for modeling these new systems. We also give an introduction to the techniques used in the session on Chip and Electrical Package Modeling for EMC.",
author = "Ruehli, {A. E.} and Cangellaris, {A. C.}",
note = "Publisher Copyright: {\textcopyright} 2001 EMC. All Rights Reserved.; 14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 2001 ; Conference date: 20-02-2001 Through 22-02-2001",
year = "2001",
doi = "10.23919/EMC.2001.10792017",
language = "English (US)",
series = "14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 2001",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 2001",
address = "United States",
}