An objective evaluation of displacement-amplifying compliant mechanisms for sensor applications

Girish Krishnan, G. K. Ananthasuresh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Displacement-amplifying compliant mechanisms (DaCMs) reported in literature are mostly used for actuator applications. This paper considers them for sensor applications that rely on displacement measurement, and evaluates them objectively. The main goal is to increase the sensitivity under constraints imposed by several secondary requirements and practical constraints. A spring-mass-lever model that effectively captures the addition of a DaCM to a sensor is used in comparing eight DaCMs. We observe that they significantly differ in performance criteria such as geometric advantage, stiffness, natural frequency, mode amplification, factor of safety against failure, cross-axis stiffness, etc., but none excel in all. Thus, a combined figure of merit is proposed using which the most suitable DaCM could be selected for a sensor application. A case-study of a micro machined capacitive accelerometer and another case-study of a vision-based force sensor are included to illustrate the general evaluation and selection procedure of DaCMs with specific applications. Some other insights gained with the analysis presented here were the optimum size-scale for a DaCM, the effect on its natural frequency, limits on its stiffness, and working range of the sensor.

Original languageEnglish (US)
Title of host publicationProceedings of 2006 ASME International Design Engineering Technical Conferences and Computers and Information In Engineering Conference, DETC2006
PublisherAmerican Society of Mechanical Engineers
ISBN (Print)079183784X, 9780791837849
DOIs
StatePublished - 2006
Externally publishedYes
Event2006 ASME International Design Engineering Technical Conferences and Computers and Information In Engineering Conference, DETC2006 - Philadelphia, PA, United States
Duration: Sep 10 2006Sep 13 2006

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume2006

Conference

Conference2006 ASME International Design Engineering Technical Conferences and Computers and Information In Engineering Conference, DETC2006
Country/TerritoryUnited States
CityPhiladelphia, PA
Period9/10/069/13/06

ASJC Scopus subject areas

  • Modeling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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