Keyphrases
Liquid Metal
100%
Heat Transfer
100%
Electronics Thermal Management
100%
Thermal Switch
100%
Active Thermal Management
100%
Gallium Nitride Device
100%
Heat Dissipation
40%
Finite Element Simulation
20%
Printed Circuit Board
20%
Electronic System
20%
High Power Density
20%
Millimeter-scale
20%
Heat Temperature
20%
Device Temperature
20%
Heat Transfer Rate
20%
Temperature System
20%
Temperature Difference
20%
Device-to-device
20%
1D Systems
20%
System Reliability
20%
Temperature Uniformity
20%
Face Area
20%
Junction Temperature
20%
Liquid Metal Droplet
20%
3D FEM
20%
Increased Reliability
20%
OFF-Mode
20%
Thermal Device
20%
Isothermalisation
20%
Heat Dissipation Optimization
20%
Thermal Resistance Model
20%
Engineering
Nitride
100%
Liquid Metal
100%
Heat Losses
60%
Printed Circuit Board
20%
Power Density
20%
Heat Transfer Rate
20%
System Reliability
20%
Junction Temperature
20%
Face Area
20%
Finite Element Analysis
20%
Heat Resistance
20%
Material Science
Gallium Nitride
100%
Liquid Metal
100%
Finite Element Method
20%
Electronic Circuit
20%
Density
20%
Heat Resistance
20%
Chemical Engineering
Gallium Nitride
100%
Chilling
60%