Abstract
Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sandwiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 45-48 |
| Number of pages | 4 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 118 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jun 1996 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering