An experimental technique for studying mixed-mode fatigue crack growth in solder joints

Daping Yao, Z. Zhang, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sandwiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.

Original languageEnglish (US)
Pages (from-to)45-48
Number of pages4
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume118
Issue number2
DOIs
StatePublished - Jun 1996

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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