An experimental technique for studying mixed-mode fatigue crack growth in solder joints

Daping Yao; Z. Zhang; J. K. Shang

doi:10.1115/1.2792130

An experimental technique for studying mixed-mode fatigue crack growth in solder joints

Daping Yao, Z. Zhang, J. K. Shang

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sandwiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.

Original language	English (US)
Pages (from-to)	45-48
Number of pages	4
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	118
Issue number	2
DOIs	https://doi.org/10.1115/1.2792130
State	Published - Jun 1996

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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AB - Failures of solder joints often result from development of cracks under complex mixed-mode loading conditions. In this study, a flexural peel technique was developed to investigate the growth of cracks at the interface between solder and Cu substrate. The technique was based on a tri-layer solder/Cu joints, with the solder layer sandwiched between two Cu layers of desired thicknesses. Finite element analysis was used to calculate the mixed-mode condition at the crack tip as a function of the thicknesses of Cu outerlayers and the solder interlayer. The application of this technique to studying interface crack growth under fatigue loading is demonstrated for eutectic solder joints.

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An experimental technique for studying mixed-mode fatigue crack growth in solder joints

Abstract

ASJC Scopus subject areas

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