An encapsulation method for the study of crack growth behaviour in inert or vacuum environments at elevated temperatures

K. Y. Hour, James F Stubbins, N. Vassos

Research output: Contribution to journalArticle

Abstract

An encapsulation technique for high-temperature controlled-environment testing is introduced. This encapsulation technique is combined with the DC potential drop technique to monitor the crack growth during the experiment. This technique eliminates the complicated retort systems of conventional mechanical testing and possesses the advantages of compactness, transportability, ease of manufacture and low cost. Test results in vacuum using this technique are compared with results of similar experiments in air and in a retort system.

Original languageEnglish (US)
Pages (from-to)237-241
Number of pages5
JournalMaterials at High Temperatures
Volume10
Issue number4
DOIs
StatePublished - Jan 1 1992

Keywords

  • Crack growth
  • Encapsulation techniques
  • Testing

ASJC Scopus subject areas

  • Ceramics and Composites
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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