Abstract
An encapsulation technique for high-temperature controlled-environment testing is introduced. This encapsulation technique is combined with the DC potential drop technique to monitor the crack growth during the experiment. This technique eliminates the complicated retort systems of conventional mechanical testing and possesses the advantages of compactness, transportability, ease of manufacture and low cost. Test results in vacuum using this technique are compared with results of similar experiments in air and in a retort system.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 237-241 |
| Number of pages | 5 |
| Journal | Materials at High Temperatures |
| Volume | 10 |
| Issue number | 4 |
| DOIs | |
| State | Published - Jan 1 1992 |
Keywords
- Crack growth
- Encapsulation techniques
- Testing
ASJC Scopus subject areas
- Ceramics and Composites
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry