An electromagnetic model for back-drilled vias

Aosheng Rong, Andreas C. Cangellaris, Feng Ling

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.

Original languageEnglish (US)
Title of host publication2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages47-50
Number of pages4
ISBN (Electronic)9781479936410
DOIs
StatePublished - Dec 3 2015
Event24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 - San Jose, United States
Duration: Oct 25 2015Oct 28 2015

Publication series

Name2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015

Other

Other24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
CountryUnited States
CitySan Jose
Period10/25/1510/28/15

Keywords

  • Foldy-Lax equation
  • Signal integrity
  • back-drilled vias
  • electromagnetic modeling

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Rong, A., Cangellaris, A. C., & Ling, F. (2015). An electromagnetic model for back-drilled vias. In 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 (pp. 47-50). [7347127] (2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2015.7347127