An ECO algorithm for resolving opc and coupling capacitance violations

Hua Xiang, Li Da Huang, Kai Yuan Chao, Martin D.F. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In the deep submicron manufacturing (DSM) era, lithography/yield and noise are critical issues to be considered. Optical Proximity Correction (OPC) is becoming a key compensate technique for the light diffraction effect in lithography. Both OPC effect and the capacitive coupling on some wire segments can only be analyzed post routing in late design stage or post-silicon stepping design change. ECO (Engineering Change Orders) is used in late design stage to fix violations that exceed the given OPC and coupling capacitance thresholds derived from analysis. These violations must be corrected in order to guarantee performance and yield. In this paper, we propose the first ECO routing algorithm which eliminates both OPC and coupling capacitance violations for wires. At the same time, the ECO routing obeys the given constraints so as to keep the new routing solution close to the existing one to preserve design timing and layout convergence.

Original languageEnglish (US)
Title of host publicationASICON 2005
Subtitle of host publication2005 6th International Conference on ASIC, Proceedings
Pages784-787
Number of pages4
StatePublished - Dec 1 2005
EventASICON 2005: 2005 6th International Conference on ASIC - Shanghai, China
Duration: Oct 24 2005Oct 27 2005

Publication series

NameASICON 2005: 2005 6th International Conference on ASIC, Proceedings
Volume2

Other

OtherASICON 2005: 2005 6th International Conference on ASIC
CountryChina
CityShanghai
Period10/24/0510/27/05

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Xiang, H., Huang, L. D., Chao, K. Y., & Wong, M. D. F. (2005). An ECO algorithm for resolving opc and coupling capacitance violations. In ASICON 2005: 2005 6th International Conference on ASIC, Proceedings (pp. 784-787). [1611444] (ASICON 2005: 2005 6th International Conference on ASIC, Proceedings; Vol. 2).