An all-purpose transmission-line model for interconnect simulation in SPICE

Mustafa Celik, Andreas C. Cangellaris, Abdul Yaghmour

Research output: Contribution to journalArticlepeer-review

Abstract

A new all-purpose multiconductor transmissionline model is described for efficient and robust interconnect simulation using nonlinear circuit simulators such as SPICE. All types of interconnects, i.e., uniform, nonuniform, lossless, lossy/dispersive, can be handled by the proposed model. Furthermore, coupling of electromagnetic radiation to interconnects can be directly modeled without the need for developing a new subcircuit. Another advantage of the proposed model is that it enables sensitivity analysis with respect to both circuit and interconnect parameters, thus facilitating interconnect circuit optimization. Chebyshev expansions for the spatial variations of the interconnect voltages and currents are used to effect highly accurate numerical approximations of the Telegrapher's equations using as small a number of degrees of freedom as possible. A simple rule of thumb is provided for the selection of the order of the approximation given the frequency bandwidth of interest. Numerical examples are presented to demonstrate the validity of the proposed model and illustrate its application to a variety of interconnect-induced noise interactions in high-speed electronic systems.

Original languageEnglish (US)
Pages (from-to)1857-1867
Number of pages11
JournalIEEE Transactions on Microwave Theory and Techniques
Volume45
Issue number10 PART 2
DOIs
StatePublished - 1997
Externally publishedYes

Keywords

  • Circuit transient analysis
  • Distributed parameter circuits
  • Integrated circuit interconnections
  • Multiconductor transmission lines
  • Packaging
  • Simulation

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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