An all-purpose dispersive multiconductor interconnect model compatible with PRIMA

Soheila Pasha; Andreas C. Cangellaris; John L. Prince

doi:10.1109/6040.928746

An all-purpose dispersive multiconductor interconnect model compatible with PRIMA

Soheila Pasha, Andreas C. Cangellaris, John L. Prince

Coordinated Science Lab

Research output: Contribution to journal › Article › peer-review

Abstract

This paper describes a new, transmission line-based discrete model for interconnects with per-unit-length, frequency-dependent resistance and inductance. The proposed model is developed in such a manner that the resulting discrete form of Telegrapher's equations constitutes a passive system, and is compatible with passive, reduced-order macromodeling algorithms. The validity of the proposed model is demonstrated through numerical examples.

Original language	English (US)
Pages (from-to)	126-131
Number of pages	6
Journal	IEEE Transactions on Advanced Packaging
Volume	24
Issue number	2
DOIs	https://doi.org/10.1109/6040.928746
State	Published - May 2001

Keywords

Circuit transient analysis
Frequency dependent ohmic loss
Macromodeling
Passive model order reduction
Skin effect
Transmission line model

ASJC Scopus subject areas

Electrical and Electronic Engineering

Online availability

10.1109/6040.928746

Library availability

Discover UIUC Full Text

Cite this

@article{d45915329f204ebdadbcc6d0b8871434,

title = "An all-purpose dispersive multiconductor interconnect model compatible with PRIMA",

abstract = "This paper describes a new, transmission line-based discrete model for interconnects with per-unit-length, frequency-dependent resistance and inductance. The proposed model is developed in such a manner that the resulting discrete form of Telegrapher's equations constitutes a passive system, and is compatible with passive, reduced-order macromodeling algorithms. The validity of the proposed model is demonstrated through numerical examples.",

keywords = "Circuit transient analysis, Frequency dependent ohmic loss, Macromodeling, Passive model order reduction, Skin effect, Transmission line model",

author = "Soheila Pasha and Cangellaris, {Andreas C.} and Prince, {John L.}",

year = "2001",

month = may,

doi = "10.1109/6040.928746",

language = "English (US)",

volume = "24",

pages = "126--131",

journal = "IEEE Transactions on Advanced Packaging",

issn = "1521-3323",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "2",

}

TY - JOUR

T1 - An all-purpose dispersive multiconductor interconnect model compatible with PRIMA

AU - Pasha, Soheila

AU - Cangellaris, Andreas C.

AU - Prince, John L.

PY - 2001/5

Y1 - 2001/5

N2 - This paper describes a new, transmission line-based discrete model for interconnects with per-unit-length, frequency-dependent resistance and inductance. The proposed model is developed in such a manner that the resulting discrete form of Telegrapher's equations constitutes a passive system, and is compatible with passive, reduced-order macromodeling algorithms. The validity of the proposed model is demonstrated through numerical examples.

AB - This paper describes a new, transmission line-based discrete model for interconnects with per-unit-length, frequency-dependent resistance and inductance. The proposed model is developed in such a manner that the resulting discrete form of Telegrapher's equations constitutes a passive system, and is compatible with passive, reduced-order macromodeling algorithms. The validity of the proposed model is demonstrated through numerical examples.

KW - Circuit transient analysis

KW - Frequency dependent ohmic loss

KW - Macromodeling

KW - Passive model order reduction

KW - Skin effect

KW - Transmission line model

UR - http://www.scopus.com/inward/record.url?scp=0035329034&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035329034&partnerID=8YFLogxK

U2 - 10.1109/6040.928746

DO - 10.1109/6040.928746

M3 - Article

AN - SCOPUS:0035329034

SN - 1521-3323

VL - 24

SP - 126

EP - 131

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

IS - 2

ER -

An all-purpose dispersive multiconductor interconnect model compatible with PRIMA

Abstract

Keywords

ASJC Scopus subject areas

Online availability

Library availability

Related links

Fingerprint

Cite this