Aluminum films prepared by metal-organic low pressure chemical vapor deposition

M. L. Green, R. A. Levy, R. G. Nuzzo, E. Coleman

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, we have chemically vapor deposited aluminum films by the pyrolysis of triisobutylaluminum, an aluminum alkyl, at temperatures of 220-300 °C onto silicon, SiO2 and device wafer substrates. The step coverage of our films is good, as demonstrated by our ability to deposit films conformally in the 2.5 μm windows of a typical device. The optical reflectivity of the films is low because of surface roughness of the order of 1000-1500 Å, which also renders them frosty in appearance. The films are highly pure aluminum with resistivities ranging between 2.8 and 3.5 μΩ cm. Transmission electron microscopy examination of the films shows them to be composed of columnar grains 1-3 μm in width, whcch may either be strongly oriented with a 〈111〉 fiber texture or be randomly poriented, depending on the surface activation treatment. Chemically vapor-deposited aluminum films have potential as metallizations for future generations of very-large-scale integrated devices.

Original languageEnglish (US)
Pages (from-to)367-377
Number of pages11
JournalThin Solid Films
Volume114
Issue number4
DOIs
StatePublished - Apr 27 1984
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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