Allocation of chips to wafers in a production problem of semiconductor kits

Sridhar Seshadri, J. G. Shanthikumar

Research output: Contribution to journalArticlepeer-review

Abstract

The problem of maximizing the production of good sels of semiconductor chips under random yield is reexamined in this paper. (A set of semiconductor chips is called a semiconductor kit.) This problem has been considered by Avram and Wein (1992) and Singh et al. (1988). To solve this problem we show that under certain combinations of assumptions the production process can be replaced by a black box. The use of the black box model considerably simplifies the analysis and reduces the simulation effort required for carrying out parametric analysis of the proposed solution procedure. The model includes that of Avram and Wein, and we extend their results to more general settings and strengthen their conclusions. Using the black box model, it is shown that the strategy of placing different types of chips on a single wafer gives larger yield of kits in a stochastic sense than the traditional method of placing single types of chips on a wafer. We compare the production of kits under different chip design and lot release policies and also carry out a parametric analysis with respect to factors such as set proportions and yield.

Original languageEnglish (US)
Pages (from-to)315-321
Number of pages7
JournalOperations Research
Volume45
Issue number2
DOIs
StatePublished - Jan 1 1997
Externally publishedYes

ASJC Scopus subject areas

  • Computer Science Applications
  • Management Science and Operations Research

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