TY - GEN
T1 - Advanced model order reduction technique in real-life IC/package design
AU - Peng, Zhen
AU - Shao, Yang
AU - Lee, Jin Fa
PY - 2010
Y1 - 2010
N2 - An real-life packaging is a multi-port system with a wide band frequency of interest. The efficient solution of such multi-input/multi-output responses over a wide frequency band adds extraordinary computational complexity to Electromagnetic simulation. In this paper, we proposed an advance model order reduction (MOR) algorithm, that is capable of producing fast and accurate computation of multi-port multi-frequency responses. This MOR technique is based on a multipoint Galerkin asymptotic waveform evaluation (MGAWE) to automate the fast frequency sweep process, and a recycling Krylov subspaces method, GCRO-DR, to gain further efficiency and to reduce the needed matrix-vector (MV) multiplications required in solving DDM matrix equation at different frequencies with multi-port excitation.Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
AB - An real-life packaging is a multi-port system with a wide band frequency of interest. The efficient solution of such multi-input/multi-output responses over a wide frequency band adds extraordinary computational complexity to Electromagnetic simulation. In this paper, we proposed an advance model order reduction (MOR) algorithm, that is capable of producing fast and accurate computation of multi-port multi-frequency responses. This MOR technique is based on a multipoint Galerkin asymptotic waveform evaluation (MGAWE) to automate the fast frequency sweep process, and a recycling Krylov subspaces method, GCRO-DR, to gain further efficiency and to reduce the needed matrix-vector (MV) multiplications required in solving DDM matrix equation at different frequencies with multi-port excitation.Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
UR - http://www.scopus.com/inward/record.url?scp=79851496692&partnerID=8YFLogxK
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U2 - 10.1109/EDAPS.2010.5683000
DO - 10.1109/EDAPS.2010.5683000
M3 - Conference contribution
AN - SCOPUS:79851496692
SN - 9781424490684
T3 - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
BT - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
T2 - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
Y2 - 7 December 2010 through 9 December 2010
ER -