Advanced model order reduction technique in real-life IC/package design

Zhen Peng, Yang Shao, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An real-life packaging is a multi-port system with a wide band frequency of interest. The efficient solution of such multi-input/multi-output responses over a wide frequency band adds extraordinary computational complexity to Electromagnetic simulation. In this paper, we proposed an advance model order reduction (MOR) algorithm, that is capable of producing fast and accurate computation of multi-port multi-frequency responses. This MOR technique is based on a multipoint Galerkin asymptotic waveform evaluation (MGAWE) to automate the fast frequency sweep process, and a recycling Krylov subspaces method, GCRO-DR, to gain further efficiency and to reduce the needed matrix-vector (MV) multiplications required in solving DDM matrix equation at different frequencies with multi-port excitation.Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.

Original languageEnglish (US)
Title of host publication2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
DOIs
StatePublished - 2010
Externally publishedYes
Event2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010 - Singapore, Singapore
Duration: Dec 7 2010Dec 9 2010

Publication series

Name2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010

Other

Other2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
Country/TerritorySingapore
CitySingapore
Period12/7/1012/9/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Advanced model order reduction technique in real-life IC/package design'. Together they form a unique fingerprint.

Cite this