Adhesive bond evaluation in laminated safety glass using guided wave attenuation measurements

S. Hou, H. Reis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Laminated safety glass samples with different levels of adhesive bond strength were manufactured and tested using mechanical guided waves. The results were then compared with those obtained using the commonly used destructive testing method, i.e., the pummel test method. The imperfect interfaces between the plastic interlayer and the two adjacent glass plates were modeled using a bed of longitudinal and shear springs. The spring constants were estimated using fracture mechanics concepts in conjunction with surface analysis using atomic force microscopy. The guided wave theoretical attenuation-based predictions of adhesion levels (obtained using this multilayered model) were validated using experimental attenuation measurements. Results show that this approach is useful in the nondestructive assessment of adhesive bond strength in laminated safety glass.

Original languageEnglish (US)
Title of host publicationAdvances in Ceramic Armor IV - A Collection of Papers Presented at the 32nd International Conference on Advanced Ceramics and Composites
Pages33-44
Number of pages12
Edition6
StatePublished - Mar 27 2009
EventAdvances in Ceramic Armor IV - 32nd International Conference on Advanced Ceramics and Composites - Daytona Beach, FL, United States
Duration: Jan 27 2008Feb 1 2008

Publication series

NameCeramic Engineering and Science Proceedings
Number6
Volume29
ISSN (Print)0196-6219

Other

OtherAdvances in Ceramic Armor IV - 32nd International Conference on Advanced Ceramics and Composites
Country/TerritoryUnited States
CityDaytona Beach, FL
Period1/27/082/1/08

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

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