Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

Keyphrases

• Adhesion Strength 100%
• Polymer Dielectrics 100%
• Strength Measurement 100%
• Interface Adhesion Strength 100%
• Dielectric Interface 100%
• Laser Spallation 100%
• Interface Strength 100%
• Processing Conditions 50%
• Wafer 50%
• Stress Wave Propagation 50%
• Silicon Nitride 50%
• Substrate Surface 50%
• Surface Morphology 50%
• Laser-induced 50%
• Surface Roughness 50%
• Spallation 50%
• Poly(p-phenylene benzobisoxazole) 50%
• Critical Interface 50%
• Value Correlate 50%
• Multilayered Materials 50%
• Autoclave 50%

Engineering

• Dielectrics 100%
• Interface Strength 100%
• Nitride 50%
• Processing Condition 50%
• Surface Morphology 50%
• Substrate Surface 50%
• Stress Wave 50%

Material Science

• Bond Strength (Materials) 100%
• Dielectric Material 100%
• Silicon 33%
• Surface Morphology 33%
• Surface Roughness 33%
• Silicon Nitride 33%
• Multilayered Material 33%