Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

Soma Sekhar V. Kandula, Cheryl D. Hartfield, Philippe H. Geubelle, Nancy R. Sottos

Research output: Contribution to journalArticle

Abstract

A laser-induced spallation technique is employed to obtain the critical interface strength of the poly-p-phenylenebenzobisoxazole (PBO) polymer and silicon nitride (SixNy) interface in a silicon (Si)/SixNy/PBO multilayered wafer. Stress wave propagation in this multilayered material is analyzed both analytically and numerically. The influence of processing conditions, substrate surface morphology and PBO formulations on the interface adhesion strength is investigated. The interface strength values correlate strongly with the PBO formulation and surface roughness of the substrate. Effect of autoclaving on the interface adhesion strength is also investigated.

Original languageEnglish (US)
Pages (from-to)7627-7635
Number of pages9
JournalThin Solid Films
Volume516
Issue number21
DOIs
StatePublished - Sep 1 2008

Fingerprint

Bond strength (materials)
spallation
Polymers
adhesion
Lasers
polymers
Silicon
Substrates
Wave propagation
lasers
Surface morphology
Surface roughness
Silicon nitride
autoclaving
formulations
Processing
stress waves
silicon nitrides
nitrides
wave propagation

Keywords

  • Adhesion
  • Delamination
  • Interface failure
  • Laser spallation
  • Wave propagation

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique. / Kandula, Soma Sekhar V.; Hartfield, Cheryl D.; Geubelle, Philippe H.; Sottos, Nancy R.

In: Thin Solid Films, Vol. 516, No. 21, 01.09.2008, p. 7627-7635.

Research output: Contribution to journalArticle

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AU - Sottos, Nancy R.

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KW - Wave propagation

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