Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

Soma Sekhar V. Kandula; Cheryl D. Hartfield; Philippe H. Geubelle; Nancy R. Sottos

doi:10.1016/j.tsf.2008.05.033

Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

Soma Sekhar V. Kandula, Cheryl D. Hartfield, Philippe H. Geubelle, Nancy R. Sottos

Research output: Contribution to journal › Article › peer-review

Abstract

A laser-induced spallation technique is employed to obtain the critical interface strength of the poly-p-phenylenebenzobisoxazole (PBO) polymer and silicon nitride (Si_xN_y) interface in a silicon (Si)/Si_xN_y/PBO multilayered wafer. Stress wave propagation in this multilayered material is analyzed both analytically and numerically. The influence of processing conditions, substrate surface morphology and PBO formulations on the interface adhesion strength is investigated. The interface strength values correlate strongly with the PBO formulation and surface roughness of the substrate. Effect of autoclaving on the interface adhesion strength is also investigated.

Original language	English (US)
Pages (from-to)	7627-7635
Number of pages	9
Journal	Thin Solid Films
Volume	516
Issue number	21
DOIs	https://doi.org/10.1016/j.tsf.2008.05.033
State	Published - Sep 1 2008

Keywords

Adhesion
Delamination
Interface failure
Laser spallation
Wave propagation

ASJC Scopus subject areas

Surfaces, Coatings and Films
Condensed Matter Physics
Surfaces and Interfaces

Online availability

10.1016/j.tsf.2008.05.033

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title = "Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique",

abstract = "A laser-induced spallation technique is employed to obtain the critical interface strength of the poly-p-phenylenebenzobisoxazole (PBO) polymer and silicon nitride (SixNy) interface in a silicon (Si)/SixNy/PBO multilayered wafer. Stress wave propagation in this multilayered material is analyzed both analytically and numerically. The influence of processing conditions, substrate surface morphology and PBO formulations on the interface adhesion strength is investigated. The interface strength values correlate strongly with the PBO formulation and surface roughness of the substrate. Effect of autoclaving on the interface adhesion strength is also investigated.",

keywords = "Adhesion, Delamination, Interface failure, Laser spallation, Wave propagation",

author = "Kandula, {Soma Sekhar V.} and Hartfield, {Cheryl D.} and Geubelle, {Philippe H.} and Sottos, {Nancy R.}",

note = "Funding Information: This research was supported by Texas Instruments and National Science Foundation Grant CMS 04-08487. ",

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doi = "10.1016/j.tsf.2008.05.033",

language = "English (US)",

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T1 - Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

AU - Kandula, Soma Sekhar V.

AU - Hartfield, Cheryl D.

AU - Geubelle, Philippe H.

AU - Sottos, Nancy R.

N1 - Funding Information: This research was supported by Texas Instruments and National Science Foundation Grant CMS 04-08487.

PY - 2008/9/1

Y1 - 2008/9/1

N2 - A laser-induced spallation technique is employed to obtain the critical interface strength of the poly-p-phenylenebenzobisoxazole (PBO) polymer and silicon nitride (SixNy) interface in a silicon (Si)/SixNy/PBO multilayered wafer. Stress wave propagation in this multilayered material is analyzed both analytically and numerically. The influence of processing conditions, substrate surface morphology and PBO formulations on the interface adhesion strength is investigated. The interface strength values correlate strongly with the PBO formulation and surface roughness of the substrate. Effect of autoclaving on the interface adhesion strength is also investigated.

AB - A laser-induced spallation technique is employed to obtain the critical interface strength of the poly-p-phenylenebenzobisoxazole (PBO) polymer and silicon nitride (SixNy) interface in a silicon (Si)/SixNy/PBO multilayered wafer. Stress wave propagation in this multilayered material is analyzed both analytically and numerically. The influence of processing conditions, substrate surface morphology and PBO formulations on the interface adhesion strength is investigated. The interface strength values correlate strongly with the PBO formulation and surface roughness of the substrate. Effect of autoclaving on the interface adhesion strength is also investigated.

KW - Adhesion

KW - Delamination

KW - Interface failure

KW - Laser spallation

KW - Wave propagation

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DO - 10.1016/j.tsf.2008.05.033

M3 - Article

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SN - 0040-6090

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EP - 7635

JO - Thin Solid Films

JF - Thin Solid Films

IS - 21

ER -

Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

Abstract

Keywords

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