Adaptive bandwidth management for performance temperature trade-offs in heterogeneous HMC+DDRx memory

Mohammad Hossein Hajkazemi, Michael Chorney, Reyhaneh Jabbarvand Behrouz, Mohammad Khavari Tavana, Houman Homayoun

Research output: Chapter in Book/Report/Conference proceedingConference contribution


High fabrication cost per bit and thermal issues are the main reasons that prevent architects from using 3D-DRAM alone as the main memory. In this paper, we address this issue by proposing a heterogeneous memory system that combines a DDRx DRAM with an emerging 3D hybrid memory cube (HMC) technology. Bandwidth and temperature management are the challenging issues for such a memory architecture. To address these challenges, first we introduce a memory page allocation policy for the heterogeneous memory system to maximize performance. Then, using the proposed policy, we introduce a temperature-aware algorithm that adaptively distributes the requested bandwidth between HMC and DDRx DRAM to reduce the thermal hotspot while maintaining high performance. The results show that the proposed memory page allocation policy can utilize the memory bandwidth close to 99% of the ideal bandwidth utilization. Moreover our temperate-aware bandwidth adaptation reduces the average steady-state temperature of the HMC hotspot across various workloads by 4.5°K while incurring 2.5% performance overhead.

Original languageEnglish (US)
Title of host publicationGLSVLSI 2015 - 25th 2015 Great Lakes Symposium on VLSI
PublisherAssociation for Computing Machinery
Number of pages6
ISBN (Electronic)9781450334747
StatePublished - May 20 2015
Externally publishedYes
Event25th Great Lakes Symposium on VLSI, GLSVLSI 2015 - Pittsburgh, United States
Duration: May 20 2015May 22 2015

Publication series

NameProceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI


Other25th Great Lakes Symposium on VLSI, GLSVLSI 2015
Country/TerritoryUnited States


  • Bandwidth
  • Heterogeneous memories
  • HMC
  • Temperature

ASJC Scopus subject areas

  • Engineering(all)


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