Active repair of self-healing polymers with shape memory alloy wires

Eva L. Kirkby, Joseph D. Rule, Véronique J. Michaud, Nancy R Sottos, Scott R White, Jan Anders E. Månson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report the first measurements of self-healing polymers with embedded shape memory alloy (SMA) wires. Improvements of healed peak loads by up to a factor of two are observed, approaching the performance of the virgin material. Moreover, the repairs can be effected with reduced amounts of healing agent. The improvements in performance of self-healing polymers with SMA wires are due to three effects: i) crack closure, which reduces the crack volume, ii) heating of the curing agent during polymerisation, which improves the cross-linking, and iii) mechanical registration of the two crack faces, which results in a reduced crack volume on closure.

Original languageEnglish (US)
Title of host publicationBehavior and Mechanics of Multifunctional and Composite Materials 2007
DOIs
StatePublished - Nov 1 2007
EventBehavior and Mechanics of Multifunctional and Composite Materials 2007 - San Diego, CA, United States
Duration: Mar 19 2007Mar 22 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6526
ISSN (Print)0277-786X

Other

OtherBehavior and Mechanics of Multifunctional and Composite Materials 2007
CountryUnited States
CitySan Diego, CA
Period3/19/073/22/07

Keywords

  • Active repair
  • Microcapsule
  • Self-healing polymer
  • Shape memory alloy wire

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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