TY - GEN
T1 - Active hot spot cooling of GaN transistors with electric field enhanced jumping droplet condensation
AU - Foulkes, Thomas
AU - Oh, Junho
AU - Birbarah, Patrick
AU - Neely, Jason
AU - Miljkovic, Nenad
AU - Pilawa-Podgurski, Robert C.N.
N1 - Publisher Copyright:
© 2017 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/5/17
Y1 - 2017/5/17
N2 - Mitigating heat generated by hot spots inside of power electronic devices is a formidable obstacle to further increases in power density. This paper presents the first demonstration of active cooling for hot spots via jumping droplet condensation. This newly discovered phase change cooling mechanism comprises 10 to 100 μm sized droplets leaping from a cold superhydrophobic surface onto a hot GaN transistor and efficiently transferring heat via evaporation. After discussing how electric fields can enhance this process, observations from cooling GaN transistors with this method are outlined. Experimental measurements demonstrate increased cooling rates and steerable heat transfer through the application of electric fields.
AB - Mitigating heat generated by hot spots inside of power electronic devices is a formidable obstacle to further increases in power density. This paper presents the first demonstration of active cooling for hot spots via jumping droplet condensation. This newly discovered phase change cooling mechanism comprises 10 to 100 μm sized droplets leaping from a cold superhydrophobic surface onto a hot GaN transistor and efficiently transferring heat via evaporation. After discussing how electric fields can enhance this process, observations from cooling GaN transistors with this method are outlined. Experimental measurements demonstrate increased cooling rates and steerable heat transfer through the application of electric fields.
UR - http://www.scopus.com/inward/record.url?scp=85019147059&partnerID=8YFLogxK
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U2 - 10.1109/APEC.2017.7930805
DO - 10.1109/APEC.2017.7930805
M3 - Conference contribution
AN - SCOPUS:85019147059
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 912
EP - 918
BT - 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Y2 - 26 March 2017 through 30 March 2017
ER -