Active compressor vapor compression cycle integrated heat transfer device

Clark W Bullard; Jason R Cartwright; Marc Allen Sulfridge; David J Beebe; Michael L Philpott; Mark A Shannon

Active compressor vapor compression cycle integrated heat transfer device

Clark W Bullard (Inventor), Jason R Cartwright (Inventor), Marc Allen Sulfridge (Inventor), David J Beebe (Inventor), Michael L Philpott (Inventor), Mark A Shannon (Inventor)

Research output: Patent

Abstract

A compact active vapor compression cycle heat transfer device. The device of the invention includes a flexible diaphragm serving as the compressive member in a layered compressor. The compressor is stimulated by capacitive electrical action and drives the relatively small refrigerant charge for the device through a closed loop defined by the compressor, an evaporator and a condenser. The evaporator and condenser include microchannel heat exchange elements to respectively draw heat from an atmosphere on a cool side of the device and expel heat into an atmosphere on a hot side of the device. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays.

Original language	English (US)
U.S. patent number	6148635
Filing date	10/19/98
State	Published - Nov 27 2000

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title = "Active compressor vapor compression cycle integrated heat transfer device",

abstract = "A compact active vapor compression cycle heat transfer device. The device of the invention includes a flexible diaphragm serving as the compressive member in a layered compressor. The compressor is stimulated by capacitive electrical action and drives the relatively small refrigerant charge for the device through a closed loop defined by the compressor, an evaporator and a condenser. The evaporator and condenser include microchannel heat exchange elements to respectively draw heat from an atmosphere on a cool side of the device and expel heat into an atmosphere on a hot side of the device. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays.",

author = "Bullard, {Clark W} and Cartwright, {Jason R} and Sulfridge, {Marc Allen} and Beebe, {David J} and Philpott, {Michael L} and Shannon, {Mark A}",

note = "This invention was made with the assistance of the Defense Advanced Research Project Agency, under contract no. DABT63-97-0069. The Government has certain rights in this invention.; 6148635",

year = "2000",

month = nov,

day = "27",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Active compressor vapor compression cycle integrated heat transfer device

AU - Bullard, Clark W

AU - Cartwright, Jason R

AU - Sulfridge, Marc Allen

AU - Beebe, David J

AU - Philpott, Michael L

AU - Shannon, Mark A

N1 - This invention was made with the assistance of the Defense Advanced Research Project Agency, under contract no. DABT63-97-0069. The Government has certain rights in this invention.

PY - 2000/11/27

Y1 - 2000/11/27

N2 - A compact active vapor compression cycle heat transfer device. The device of the invention includes a flexible diaphragm serving as the compressive member in a layered compressor. The compressor is stimulated by capacitive electrical action and drives the relatively small refrigerant charge for the device through a closed loop defined by the compressor, an evaporator and a condenser. The evaporator and condenser include microchannel heat exchange elements to respectively draw heat from an atmosphere on a cool side of the device and expel heat into an atmosphere on a hot side of the device. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays.

AB - A compact active vapor compression cycle heat transfer device. The device of the invention includes a flexible diaphragm serving as the compressive member in a layered compressor. The compressor is stimulated by capacitive electrical action and drives the relatively small refrigerant charge for the device through a closed loop defined by the compressor, an evaporator and a condenser. The evaporator and condenser include microchannel heat exchange elements to respectively draw heat from an atmosphere on a cool side of the device and expel heat into an atmosphere on a hot side of the device. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays.

M3 - Patent

M1 - 6148635

Y2 - 1998/10/19

ER -

Active compressor vapor compression cycle integrated heat transfer device

Abstract

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