Abstract
Acousto-Ultrasonic (A-U) nondestructive evaluation of finger joints in structural lumber has been conducted to evaluate the adhesive bond strength using the stress wave factor (SWF) measurement technique. Wood specimens with different levels of adhesive bond strength were manufactured and nondestructively tested using the acousto-ultrasonic stress wave factor approach. The strength of the finger joints was then evaluated using the commonly used destructive tensile strength test method. It was observed that higher values of the SWF measurements correspond to higher values of the tensile strength test data. Therefore, these results show that the acousto-ultrasonic approach has the potential of being used in quality assurance of the adhesive bond strength of finger joint connections during the manufacturing process.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 509-510 |
| Number of pages | 2 |
| Journal | British Journal of Non-Destructive Testing |
| Volume | 32 |
| Issue number | 10 |
| State | Published - Oct 1990 |
ASJC Scopus subject areas
- Engineering(all)