Accurate passive component models in coplanar waveguide for 50 GHz MMICs

R. Shimon, D. Scherrer, D. Caruth, J. Middleton, H. Hsia, M. Feng

Research output: Contribution to journalConference article

Abstract

Accurate circuit models for several passive components in coplanar waveguide have been developed. These models utilize lumped and distributed circuit elements available in computer-aided design software packages and have element values that are derived from measured S-parameter data, geometrical data and physical process parameters. This work discusses the development of the models and verifies their accuracy by comparing measured and modeled S-parameters to 50 GHz.

Original languageEnglish (US)
Pages (from-to)769-772
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume2
StatePublished - Jan 1 1997
EventProceedings of the 1997 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Denver, CO, USA
Duration: Jun 8 1997Jun 13 1997

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Coplanar waveguides
Monolithic microwave integrated circuits
Scattering parameters
waveguides
Networks (circuits)
computer aided design
Software packages
Computer aided design
computer programs

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Accurate passive component models in coplanar waveguide for 50 GHz MMICs. / Shimon, R.; Scherrer, D.; Caruth, D.; Middleton, J.; Hsia, H.; Feng, M.

In: IEEE MTT-S International Microwave Symposium Digest, Vol. 2, 01.01.1997, p. 769-772.

Research output: Contribution to journalConference article

Shimon, R, Scherrer, D, Caruth, D, Middleton, J, Hsia, H & Feng, M 1997, 'Accurate passive component models in coplanar waveguide for 50 GHz MMICs', IEEE MTT-S International Microwave Symposium Digest, vol. 2, pp. 769-772.
Shimon, R. ; Scherrer, D. ; Caruth, D. ; Middleton, J. ; Hsia, H. ; Feng, M. / Accurate passive component models in coplanar waveguide for 50 GHz MMICs. In: IEEE MTT-S International Microwave Symposium Digest. 1997 ; Vol. 2. pp. 769-772.
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